TECHNOLOGY
核心技術
以 SiC 與高壓直流電源，重新定義 AI 基礎建設的效率與功率密度。
01
SiC Power Semiconductor
650V / 1200V / 1700V platform direction for high-frequency, high-temperature and high-efficiency power conversion.
02
800VDC AI Power
Power-conversion architecture for next-generation AI racks, from front-end rectification and conversion through rack-level DC power.
03
13.8kV → 800VDC SiC SST
Solid-state transformer architecture using SiC power devices to support medium-voltage input, isolation, conversion and an 800VDC AI-factory backbone.
04
AI NIC / DPU
High-speed networking and data-processing architecture for AI data-center traffic, acceleration and infrastructure offload.
SYSTEM ARCHITECTURE
13.8kV → 800VDC → AI Rack
Medium Voltage Input13.8kV AC
↓
SiC Front-End / SSTPower conversion + isolation
↓
800VDC BackboneHigh-voltage DC distribution
↓
Rack Power StageCRPS / DC-DC / power module
↓
AI Compute InfrastructureGPU · Network · Storage