TECHNOLOGY

Core Technology

Power semiconductor to AI infrastructure.

SiC Power Semiconductor

650V class Schottky Barrier Diode and future power-device platforms.

800VDC AI Power

High-voltage DC architecture for next-generation AI server and rack power.

13.8kV → 800VDC SiC SST

Solid-state transformer architecture for AI factory power conversion.

AI NIC / DPU

High-speed networking and data-processing infrastructure.

HUIWEI SEMICONDUCTOR FUNDAMENTALS

半導體製程與元件結構

透過 3D 概念圖與技術說明,理解 Bipolar、CMOS、BiCMOS 與 Diode、BJT、MOSFET 的差異,連結匯微功率應用。

Huiwei semiconductor process concept illustration