INVESTORS
投資人專區
以 SiC、800VDC 與 AI 基礎建設為核心的長期成長策略。
INVESTMENT THESIS
Power is becoming AI infrastructure.
AI compute density is increasing the strategic importance of power conversion, DC distribution, thermal design and high-speed networking. Huiwei's roadmap connects these domains through SiC power, AI-server power and AI networking.
01
SiC
Core power-semiconductor platform.
02
800VDC
Next-generation AI power backbone.
03
AI NIC / DPU
Network and data infrastructure.
04
Global Expansion
Asia supply chain with Japan and U.S. market development.
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